Mana Module (W) | 560~580 | 555~570 | 620~635 | 680~700 |
ʻAno Module | ʻUniʻoniʻoni-560~580 | ʻUni-555~570 | Lāhina-620~635 | ʻUnihina-680~700 |
Māmā o ka Module | 22.50% | 22.10% | 22.40% | 22.50% |
Nui Module (mm) | 2278×1134×30 | 2278×1134×30 | 2172×1303×33 | 2384×1303×33 |
ʻO ka hoʻohui hou ʻana o nā electrons a me nā lua ma luna o ka ʻili a me nā mea āpau ke kumu nui e kaupalena ana i ka pono kelepona, a
Ua hoʻomohala ʻia nā ʻenehana passivation like ʻole e hōʻemi i ka hui hou ʻana, mai ka BSF (Back Surface Field) i kēia manawa a hiki i ka PERC kaulana i kēia manawa (Passivated Emitter a me Rear Cell), HJT hou loa (Heterojunction) a me nā ʻenehana TOPCon i kēia manawa. ʻO TOPCon kahi ʻenehana passivation kiʻekiʻe, i kūpono me nā wafers silicon P-type a me N-type a hiki ke hoʻonui nui i ka pono o ka cell ma o ka ulu ʻana i kahi ʻāpana ʻokiʻoki ultra-thin a me kahi papa polysilicon doped ma ke kua o ke kelepona e hana i kahi mea maikaʻi. ka hoʻopaʻa ʻana i ke alo. Ke hui pū ʻia me nā wafers silika N-type, ua manaʻo ʻia ʻo 28.7% ka palena kūpono o luna o nā cell TOPCon, ma mua o ka PERC, ʻo ia ka 24.5%. ʻOi aku ka maikaʻi o ka hana ʻana o TOPCon i nā laina hana PERC i kēia manawa, no laila ke kaupaona nei i ke kumukūʻai hana ʻoi aku ka maikaʻi a me ka ʻoi aku ka maikaʻi o ka module. Manaʻo ʻia ʻo TOPCon e lilo i ʻenehana kelepona nui i nā makahiki e hiki mai ana.
ʻOi aku ka maikaʻi o nā modula TOPCon. ʻO ka hoʻomaikaʻi ʻana i ka hana māmā haʻahaʻa e pili nui ana i ka optimization o ke kūpaʻa series, e alakaʻi ana i nā kahawai saturation haʻahaʻa i nā modules TOPCon. Ma lalo o ke kukui haʻahaʻa (200W/m²), ʻoi aku ka nui o ka hana o 210 TOPCon modules ma kahi o 0.2% kiʻekiʻe ma mua o 210 PERC modules.
Hoʻopili ka mahana hana o nā modula i kā lākou mana. Hoʻokumu ʻia nā modula Radiance TOPCon ma luna o nā wafers silika N-type me ka mea lawe liʻiliʻi kiʻekiʻe i ke ola a me ka ʻoi aku ke kiʻekiʻe. ʻOi aku ke kiʻekiʻe o ka puʻupuʻu hāmama, ʻoi aku ka maikaʻi o ke koena wela o ka module. ʻO ka hopena, ʻoi aku ka maikaʻi o nā modula TOPCon ma mua o nā modula PERC i ka wā e hana ana i nā wahi wela kiʻekiʻe.
Q1: He hale hana a ʻoihana kālepa paha ʻoe?
A: He hale hana mākou i ʻoi aku ma mua o 20 mau makahiki i ka hana ʻana; ikaika ma hope o ke kūʻai aku i ka hui lawelawe a me ke kākoʻo ʻenehana.
Q2: He aha ka MOQ?
A: Loaʻa iā mākou nā huahana a me nā huahana semi-finished me nā lako kumu kūpono no ka laʻana hou a me ke kauoha no nā hiʻohiʻona a pau, No laila ua ʻae ʻia ka liʻiliʻi liʻiliʻi, hiki ke hoʻokō pono i kāu koi.
Q3: No ke aha i ʻoi aku ka liʻiliʻi o nā mea ʻē aʻe?
Ke ho'āʻo nei mākou i kā mākou maikaʻi loa e hōʻoia i ko mākou maikaʻi e lilo i mea maikaʻi loa i nā huahana kumukūʻai pae like. Manaʻo mākou he mea nui ka palekana a me ka pono.
Q4: Hiki iaʻu ke loaʻa kahi laʻana no ka hoʻāʻo?
ʻAe, ʻoluʻolu ʻoe e hoʻāʻo i nā laʻana ma mua o ke kauoha nui; E hoʻouna ʻia ke kauoha laʻana i nā lā 2- -3 maʻamau.
Q5: Hiki iaʻu ke hoʻohui i kaʻu logo ma nā huahana?
ʻAe, loaʻa iā OEM a me ODM no mākou. Akā, pono ʻoe e hoʻouna mai iā mākou i ka palapala ʻae Trademark.
Q6: Loaʻa iā ʻoe nā kaʻina hana nānā?
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